Accessories

SOM-COMe-CT6-TGL-U HEAT SINK

$44.25

Heat Sink Active.

DEV-KIT-COMe-T6

$1,539.00

Compatible with both x86 and Arm COM Express® Type 6 modules.

CARRIER-COMe-T6-C30

$255.00

Carrier Board for COM Express™ Type 6 Modules.

CABLE KIT CARRIER C30

$41.25

Cables Kit for CCOMe-C30.

$657.00

SOM-COMe-CT6-TGL-U 1115GRE

Estimated delivery time: 2-5 working days after payment confirmation

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SOM-COMe-CT6-TGL-U 1115GRE

Usually ships in 2-4 days

With 11th Gen Intel® Core™ i3-1115GRE.

Available

Quantity:

$657.00 excl. TAX/VAT/SHIPPING

More Information
CPU	Intel® Core™ i3-1115GRE, Dual Core @3.0GHz (3.9GHz Turbo Boost), 6MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading - Industrial
Graphics	Integrated Intel® Iris® Xe Graphics, up to 96 Execution Units
Connectivity	1x GbE; 4x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x4 Gen4
Memory	Two DDR4 SO-DIMM slots supporting DDR4-3200 memory, up to 64GB IBECC DDR4 memory modules supported only with Intel® Core™ Industrial SoCs

SOM-COMe-CT6-TGL-U 1115GRE

Full Specs

More Information
Processor	Intel® Core™ i3-1115GRE, Dual Core @3.0GHz (3.9GHz Turbo Boost), 6MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading - Industrial
Cores	2
Memory	Two DDR4 SO-DIMM slots supporting DDR4-3200 memory, up to 64GB IBECC DDR4 memory modules supported only with Intel® Core™ Industrial SoCs
Graphics	Intel® Iris® Xe Graphics, up to 96 Execution Units Up to 4 independent displays supported Support DirectX 12, OpenGL 4.6, OpenCL 3.0 and Vulkan 1.2 HW accelerated video decode AVC/H.264, HEVC/H.265, VP81, VP9, AV1 HW accelerated video encode AVC/H.264, HEVC/H.265, VP81, VP9
Video Interfaces	Up to 3x Digital Display Interfaces (DDIs), supporting DP 1.2, eDP 1.4, HDMI 1.4, DVI 1 x eDP 1.4 or Single/Dual-Channel 18-/24-bit LVDS interface 1 x VGA interface eDP, DP: up to 5120x3200 @60Hz 24bpp / 7680x4320 @60Hz 30bpp with DSC HDMI: up to 4096x2160 @24Hz, 24bpp LVDS: up to 1920x1200 @60Hz VGA: up to 2048 x 1536 @50Hz
Mass Storage	2x SATA Gen3 channels 2x PCI-e x4 ports available for M.2 NVMe drives
Networking	Gigabit Ethernet interface Intel® I225 GbE controller
Usb	4x SuperSpeed USB 5Gbps host ports 8x USB 2.0 Host ports
Audio	HD audio interface
Serial Ports	2x UARTs
Other Interfaces	8x PCI-e x1 Gen3 lanes PCI-express Graphics (PEG) x4 Gen4 SPI, I2C, SM bus, thermal management, FAN management LPC bus Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4x GPI, 4x GPO
Power Supply	8VDC..20VDC, +5VSB (optional), +3VRTC (optional)
Operating System	Microsoft® Windows 10 Microsoft® Windows 10 IoT Core Linux
Dimensions	95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)
Operating Temperature	0°C ÷ +60°C (Commercial) -40°C ÷ +85°C (Industrial) Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

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Full Specs

More Information
Processor	Intel® Core™ i3-1115GRE, Dual Core @3.0GHz (3.9GHz Turbo Boost), 6MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading - Industrial
Cores	2
Memory	Two DDR4 SO-DIMM slots supporting DDR4-3200 memory, up to 64GB IBECC DDR4 memory modules supported only with Intel® Core™ Industrial SoCs
Graphics	Intel® Iris® Xe Graphics, up to 96 Execution Units Up to 4 independent displays supported Support DirectX 12, OpenGL 4.6, OpenCL 3.0 and Vulkan 1.2 HW accelerated video decode AVC/H.264, HEVC/H.265, VP81, VP9, AV1 HW accelerated video encode AVC/H.264, HEVC/H.265, VP81, VP9
Video Interfaces	Up to 3x Digital Display Interfaces (DDIs), supporting DP 1.2, eDP 1.4, HDMI 1.4, DVI 1 x eDP 1.4 or Single/Dual-Channel 18-/24-bit LVDS interface 1 x VGA interface eDP, DP: up to 5120x3200 @60Hz 24bpp / 7680x4320 @60Hz 30bpp with DSC HDMI: up to 4096x2160 @24Hz, 24bpp LVDS: up to 1920x1200 @60Hz VGA: up to 2048 x 1536 @50Hz
Mass Storage	2x SATA Gen3 channels 2x PCI-e x4 ports available for M.2 NVMe drives
Networking	Gigabit Ethernet interface Intel® I225 GbE controller
Usb	4x SuperSpeed USB 5Gbps host ports 8x USB 2.0 Host ports
Audio	HD audio interface
Serial Ports	2x UARTs
Other Interfaces	8x PCI-e x1 Gen3 lanes PCI-express Graphics (PEG) x4 Gen4 SPI, I2C, SM bus, thermal management, FAN management LPC bus Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4x GPI, 4x GPO
Power Supply	8VDC..20VDC, +5VSB (optional), +3VRTC (optional)
Operating System	Microsoft® Windows 10 Microsoft® Windows 10 IoT Core Linux
Dimensions	95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)
Operating Temperature	0°C ÷ +60°C (Commercial) -40°C ÷ +85°C (Industrial) Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

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COM Express Type 6 Compact w/ 11th Gen Intel® Core™ i3-1115GRE (DC @ 3.0GHz up to 3.9GHz, 28W TDP – 12W cTDP, w/IBECC). (CALYPSO - D40)
Part Number: MD40-7000-2120-I1

SOM-COMe-CT6-TGL-U 1115GRE

Estimated delivery time: 2-5 working days after payment confirmation

$657.00 excl. TAX/VAT/SHIPPING

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SOM-COMe-CT6-TGL-U 1185GRE
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