€
€ 
SOM-SMARC-EHL X6425E HEAT SINK
13,50 €
Heat Sink passivo.
DEV-KIT-SMARC
952,00 €
2.0 / 2.1 / 2.1.1 Development Kit.
SOM-SMARC-EHL X6425E
349,50 €
SOM-SMARC-EHL X6425E
Solitamente spedito in 2-4 giorni
Con Intel® Atom™ x6425E (SKU7, QC up to 3.00 GHz, TDP 12W) w/IBECC 8GB RAM, 64GB eMMC.
Disponibile
349,50 €
escl. IVA/SPEDIZIONE
| CPU | Intel® Atom™ x6425E (SKU7, QC up to 3.00 GHz, TDP 12W) |
|---|---|
| Graphics | Integrated Gen11 UHD Graphics controller supporting 3 independent displays |
| Connectivity | 2x Gigabit Ethernet PHY with precision clock synchronization and synchronous Ethernet clock output for IEEE 1588 (Safety Related – Black channel) Optional SERDES (SGMII) Interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane) |
| Memory | Quad Channel 8GB LPDDR4x Soldered Down with IBECC |
SOM-SMARC-EHL X6425E
| Processore | Intel® Atom™ x6425E (SKU7, QC up to 3.00 GHz, TDP 12W) |
|---|---|
| Core | 4 |
| Memoria | Quad Channel 8GB LPDDR4x Soldered Down with IBECC Speed: 4267MT/s single rank |
| Scheda Grafica | Up to 3 independent displays Integrated Gen11 UHD Graphics controller with up to 32 EU 4K HW decoding and encoding of HEVC (H.265), H.264, VP8/VP9, WMV9/VC1 (decoding only) DirectX 12.1, OpenGL ES 3.1, OpenGL 4.5, OpenCL™ 1.2, Vulkan 1.0 |
| Interfacce Video | LVDS interface (factory options) 2 x DP++ 1.4 or 1x DP++ 1.4 and 1x HDMI 1.4 interfaces Up to 4096x2160 @60Hz |
| Memoria Di Massa | 1 x external S-ATA Gen3 Channel SDIO interface 64GB eMMC 5.1 drive soldered on-board (Safety Related) |
| Rete | 2x Gigabit Ethernet PHY with precision clock synchronization and synchronous Ethernet clock output for IEEE 1588 (Safety Related – Black channel) Optional SERDES (SGMII) Interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane) |
| Usb | 6 x USB 2.0 Host Ports 2 x USB 3.1 Gen2 Ports |
| Audio | HD Audio interface |
| Porte Seriali | 2 x HS-UARTs (Safety Related) 2 x UARTs |
| Altre Interfacce | Up to 4 x PCI-e Gen3 Lanes SM Bus Power Management Signals I2C Bus 1x SPI interface for boot 1x General Purpose SPI or eSPI (Factory Alternatives) |
| Alimentazione | +5VDC and +3.3V_RTC |
| Sistema Operativo | Microsoft® Windows 10 Enterprise (64 bit) Linux Yocto 64-bit |
| Dimensioni | 50 x 82 mm |
| Operating Temperature | -40°C ÷ +85°C (Industrial version)* *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
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| Processore | Intel® Atom™ x6425E (SKU7, QC up to 3.00 GHz, TDP 12W) |
|---|---|
| Core | 4 |
| Memoria | Quad Channel 8GB LPDDR4x Soldered Down with IBECC Speed: 4267MT/s single rank |
| Scheda Grafica | Up to 3 independent displays Integrated Gen11 UHD Graphics controller with up to 32 EU 4K HW decoding and encoding of HEVC (H.265), H.264, VP8/VP9, WMV9/VC1 (decoding only) DirectX 12.1, OpenGL ES 3.1, OpenGL 4.5, OpenCL™ 1.2, Vulkan 1.0 |
| Interfacce Video | LVDS interface (factory options) 2 x DP++ 1.4 or 1x DP++ 1.4 and 1x HDMI 1.4 interfaces Up to 4096x2160 @60Hz |
| Memoria Di Massa | 1 x external S-ATA Gen3 Channel SDIO interface 64GB eMMC 5.1 drive soldered on-board (Safety Related) |
| Rete | 2x Gigabit Ethernet PHY with precision clock synchronization and synchronous Ethernet clock output for IEEE 1588 (Safety Related – Black channel) Optional SERDES (SGMII) Interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane) |
| Usb | 6 x USB 2.0 Host Ports 2 x USB 3.1 Gen2 Ports |
| Audio | HD Audio interface |
| Porte Seriali | 2 x HS-UARTs (Safety Related) 2 x UARTs |
| Altre Interfacce | Up to 4 x PCI-e Gen3 Lanes SM Bus Power Management Signals I2C Bus 1x SPI interface for boot 1x General Purpose SPI or eSPI (Factory Alternatives) |
| Alimentazione | +5VDC and +3.3V_RTC |
| Sistema Operativo | Microsoft® Windows 10 Enterprise (64 bit) Linux Yocto 64-bit |
| Dimensioni | 50 x 82 mm |
| Operating Temperature | -40°C ÷ +85°C (Industrial version)* *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
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SMARC® Rel con Intel® Atom™ x6425E (SKU7, QC up to 3.00 GHz, TDP 12W) w/IBECC 8GB RAM, 64GB eMMC. (HALLEY - C93)
Part Number: RC93-S471-4021-I4
Part Number: RC93-S471-4021-I4
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![SOM-SMARC-EHL X6425E HEAT SINK]()
SOM-SMARC-EHL X6425E HEAT SINK13,50 € escl. IVA/SPEDIZIONE -
![DEV-KIT-SMARC]()
DEV-KIT-SMARC952,00 € escl. IVA/SPEDIZIONE
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