Accessori

SOM-SMARC-MX8M HEAT SPREADER

9,75 €

Heat Spreader Passivo.

SOM-SMARC-MX8M HEAT SINK

15,75 €

Heat Sink Passivo.

DEV-KIT-SMARC

952,00 €

2.0 / 2.1 / 2.1.1 Development Kit.

159,00 €

SOM-SMARC-MX8M QUAD LITE 2GB

Tempi di consegna stimati: 2-5 giorni lavorativi successivi alla conferma del pagamento

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SOM-SMARC-MX8M QUAD LITE 2GB

Solitamente spedito in 2-4 giorni

Con NXP i.MX8M Quad Lite1.3 GHz, LPDDR4 2 GB, eMMC 8 GB.

Disponibile

Quantità:

159,00 € escl. IVA/SPEDIZIONE

Maggiori Informazioni
CPU	i.MX8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU
Graphics	Integrated Graphics Processing Unit, supports 2 independent displays
Connectivity	1 x Gigabit Ethernet interface Optional WiFi + BT LE module onboard
Memory	Soldered Down 2GB LPDDR4-3200 memory,

SOM-SMARC-MX8M QUAD LITE 2GB

Specifiche

Maggiori Informazioni
Processore	i.MX8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU
Core	4
Memoria	Soldered Down 2GB LPDDR4-3200 memory
Scheda Grafica	Integrated Graphics Processing Unit, supports 2 independent displays Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1
Interfacce Video	Integrated Graphics Processing Unit, supports 2 independent displays Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1
Memoria Di Massa	Optional SD 4-bit interface QSPI Flash soldered-onboard 8GB eMMC 5.0 drive soldered on-board
Rete	1 x Gigabit Ethernet interface Optional WiFi + BT LE module onboard
Usb	2 USB 3.0 Host ports 2 USB 2.0 Host ports 1 USB 2.0 OTG port
Audio	I2S Audio Interface
Porte Seriali	Up to 2x UART Tx/Rx/RTS/CTS 2x UART Tx/Rx
Altre Interfacce	2x PCI-e x1 ports 1x 4-lanes + 1x 2-lanes CSI camera interfaces I2C Bus SM Bus 2x SPI interfaces QuadSPI interface 14 x GPI/Os Boot select signals Power Management Signals
Alimentazione	+5VDC +3.3V_RTC
Sistema Operativo	Linux Yocto Android
Dimensioni	50 x 82 mm (1.97” x 3.23”)
Operating Temperature	0°C ÷ +60°C (Commercial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

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Specifiche

Maggiori Informazioni
Processore	i.MX8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU
Core	4
Memoria	Soldered Down 2GB LPDDR4-3200 memory
Scheda Grafica	Integrated Graphics Processing Unit, supports 2 independent displays Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1
Interfacce Video	Integrated Graphics Processing Unit, supports 2 independent displays Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1
Memoria Di Massa	Optional SD 4-bit interface QSPI Flash soldered-onboard 8GB eMMC 5.0 drive soldered on-board
Rete	1 x Gigabit Ethernet interface Optional WiFi + BT LE module onboard
Usb	2 USB 3.0 Host ports 2 USB 2.0 Host ports 1 USB 2.0 OTG port
Audio	I2S Audio Interface
Porte Seriali	Up to 2x UART Tx/Rx/RTS/CTS 2x UART Tx/Rx
Altre Interfacce	2x PCI-e x1 ports 1x 4-lanes + 1x 2-lanes CSI camera interfaces I2C Bus SM Bus 2x SPI interfaces QuadSPI interface 14 x GPI/Os Boot select signals Power Management Signals
Alimentazione	+5VDC +3.3V_RTC
Sistema Operativo	Linux Yocto Android
Dimensioni	50 x 82 mm (1.97” x 3.23”)
Operating Temperature	0°C ÷ +60°C (Commercial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.